The CHOOSE executive board and Zühlke Engineering AG are pleased to invite you to a presentation. ------------------------------------------------------------------- An Object Oriented Software Architecture for Semiconductor Manufacturing Machines: A Case Study ========================================= When: Wednesday 28. September 2005, @17h00 Where: Zühlke Engineering AG, Wiesenstrasse 10a, 8952 Schlieren Travel instructions: http://www.zuehlke.com/de/uber_uns/lageplan_zurich.cfm?u=18532800081486 NOTE: registration for this event is required because we have to prepare the apero. Please fill out the registration form at the end of this e-mail. Speakers -------- Alexander Beck, Unaxis Daniel Tobler, Zühlke Agenda ------ 17h00 - 18h15 Talk and Q/A Afterwards you are invited to a refreshment. Abstract ======== Bonding machines (bonders) are automated chip assembly equipment used in the semiconductor industry to package microchips. Thousands of bonders are used in large microchip plants throughout Asia. The company, Unaxis Switzerland Ltd. Assembly & Packaging (ESEC), in Cham has been developing such bonders for many years. There are basically two types of bonders, wire bonders and die bonders. Die bonders pick dice (silicon chips) from a wafer on which microchips have been photolyticly produced and attach them to a carrier material. A die bonder has to rapidly place dice very accurately. The latest generation of die bonders place up to four dice per second. Wire bonders place gold wires from the die to the carrier, so that the die's logic can connect to the outside world. A wire bonder has to be even more accurate and connects up to 20 wires per second. This speech focuses on the control software for the bonder. It is programmed completely in C++. A modular, layered and encapsulated architecture is emphasized. Its size is around some hundred thousand source lines of code and currently several dozen software developers work on the project. This speech focuses on the following topics: * What does a bonder do and what are the processes that must be controlled by the software shown as an example of a die bonder. * How the different layers and subsystems were identified and which methods were suitable. * How the control software is distributed on different computer systems and what aspects led to this decision including the communication between these processes. * How does the software design consider the parallel tasks that must be controlled and which patterns suited our parallel software more and which less. * Data entry for production setup supporting an undo function and system wide dependencies on changing dependant data. * Efficient project controlling: Which processes proved of value and which processes did not. Bios ==== Alexander Beck has been working for more than 5 years in the area of object-oriented software engineering. He graduated in 1999 from the Swiss Federal Institute of Technology Zurich with a M. Sc. in Computer Science. After finishing his education, Alexander Beck developed software at ESEC (today Unaxis Switzerland) in several R&D projects for new chip assembly bonding machines. Since the beginning of 2005, he is a Software Architect for the new generation of die bonder machines. Daniel Tobler has been working for more than 10 years in the area of object-oriented software engineering. He graduated in 1995 from the University of Applied Sciences in Rapperswil with a B. Sc. in Electronic Engineering. In 1998 he received a Post-graduate Diploma in Software Engineering from the same University. After his studies, Daniel Tobler developed software for embedded systems for Siemens Building Technologies. At ESEC, he was responsible as a Project Manager for the development of the software for a new Wire-Bonder and worked afterwards as a Software Architect on various projects in the same domain. Since 2005, he has worked at Zühlke as a Software Architect for embedded and realtime systems. Daniel Tobler lectures object-oriented design in a post-graduate course at the University for Applied Sciences in Rapperswil and regularly supervises diploma projects related to this course. ----------------------------------------------------------------------- This event is free even the drinks after the talk! Non-CHOOSE members are encouraged to fill out the membership application form (http://www.s-i.ch/si-appl.html) before attending the meeting. If you want to know more about CHOOSE and the events which CHOOSE organises, please visit http://www.choose.s-i.ch/. REGISTRATION ------------ Please DO NOT reply to this e-mail! Fill in the form below and sent it to <mailto:choose@glue.ch>. Thanks. 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